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Tecnisco, Ltd.
2-2-15, Minami-Shinagawa, Shinagawa-ku
Tokyo, 140-0004 JAPAN
phone: +81-3-3472-6963
fax: +81-3-3472-1316
wu-wl@tecnisco.co.jp
www.tecnisco.co.jp/en/

TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a "Cross-edge" micro processing technology which crosses five leading-edge technologies such as cutting, grinding, polishing, metalizing, and bonding, thus supporting high-tech products in the industries of optical communication, industrial laser, AV/mobile, projector, automotive and medical devices.



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